Update:
Final report sent to PM on 6/29/2023
View uploaded report
Conductive hydrogels, as a typical flexible soft material with structural resemblance to biological tissues and excellent electronic properties, have flourished as promising candidates for applications in the fields of artificial intelligence, soft robotics, and wearable devices. Many of these advanced applications require demanding gel properties including high stretchability, self-healing ability, adhesiveness, multi-environmental tolerance (e.g., drying and freezing), good and durable sensitivity, and comfortability on human bodies. Yet, it remains a challenge to provide all these properties at the same time in one single gel product. The goal of this project is to develop a multifunctional high-performance ionic conductive hydrogel using soy protein isolate (SPI) as a main ingredient.
The hydrogels containing mainly SPI and polyvinyl alcohol (PVA) were developed. A series of other functional agents were also added to the gel formulations to impart different gel functionalities and tailor gel properties. The contents of the ingredients were varied. Gel properties of different formulations including mechanical, self-healing, adhesion, anti-freezing, and conductivity under different temperatures were systematically tested.
It was found that multiple chemical and physical interactions could be established among the ingredients of the gel, which allow the gel’s properties to be tailored significantly by varying its formulation. One of the best formulations produced a gel that shows simultaneous high stretchability (806%), good tensile strength (22.7 KPa), high self-healing efficiency (92.31% after healing for 2 min at room temperature), favorable adhesiveness to different substrates (e.g., skin, stainless steel, glass, PP, ceramic, Teflon, ABS, wood, and paper carton), high ionic conductivity (1.52 S/m) at room temperature, and outstanding anti-freezing property (flexible and conductive at -70 °C). These desirable properties make it a promising material in advanced flexible electronics applications.
An advanced new use for SPI was developed in this project. This new use targets cutting-edge and high-value industries such as robotics, health, biomedical sciences, AI, and more. This innovative utilization holds the potential to yield substantial profits for soybean farmers and the industries.